The 6th International Conference on Engineering, Physics, MEMS–Biomedical Sensors and Applications (ICEBA 2025) successfully concluded following a series of academic activities held across two locations: National Central University (NCU) in Taiwan and Eastern International University (EIU) in Binh Duong, Viet Nam (11–12 November). The event was jointly organised by VNUHCM-University of Science (HCMUS), Tohoku University (Japan), NCU (Taiwan), and EIU.
With a tradition of rotating the hosting duties between HCMUS and Tohoku University, the conference has become a prestigious regional academic forum, convening scientists working in cutting-edge engineering and technology fields. This year’s session attracted approximately 80 researchers and experts, along with more than 70 high-quality scientific reports.
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Assoc. Prof. Trần Minh Triết, Vice President of VNUHCM-University of Science, delivering the opening address for the conference at the Viet Nam location.
The academic content covered a wide range of advanced research directions, including: Engineering and Engineering Physics; Electrical Engineering and Electronics; MEMS and Sensors ; Semiconductor Devices and IC Microchips; Microelectronics and Microfluidics; Biomedical Engineering and Medical Physics; IoT and Embedded Systems; Simulation and Modelling; AI and Machine Learning; Renewable Energy; Mechanical Engineering, Robotics, and Advanced Manufacturing Technology; along with topics related to Nuclear Engineering.
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Assoc. Prof. Vũ Thị Hạnh Thu, Deputy Head of the Applied Physics Department, Faculty of Physics – Engineering Physics, VNUHCM-University of Science, presenting research at a specialised ICEBA 2025 subcommittee session.
The conference programme comprised two main sessions: a plenary session featuring presentations on new trends and pioneering research directions from international experts; and specialised subcommittee sessions, where research groups presented in-depth findings. The multi-location Taiwan–Viet Nam organisational model helped maintain continuous academic exchange, fostering interaction and expanding connections between the scientific communities of both countries.
ICEBA 2025 further made an impression through effective connectivity between universities and businesses, opening numerous opportunities for collaborative research and technology transfer. With diverse, multi-disciplinary themes, the conference contributes to promoting the development of advanced engineering and technology sectors across the region.
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Representatives from VNUHCM-University of Science, Tohoku University (Japan), the Ho Chi Minh City Semiconductor Industry Association, and the SHTP R&D Center signed an MoU. This agreement formalises the coordination for co-organising ICEBA 2026 (the 7th conference) and affirms a long-term commitment to collaboration in interdisciplinary research, MEMS–sensors, and semiconductor microchips.
Concluding this year’s session, ICEBA once again confirmed the event’s status as a prestigious international scientific forum in the fields of MEMS, sensors, physics, engineering, and related technologies. ICEBA 2026 is expected to be co-organised by VNUHCM-University of Science; Tohoku University; the Ho Chi Minh City Semiconductor Industry Association; and the Research and Development Centre of the Saigon Hi-Tech Park (SHTP R&D Center). This future session is anticipated to continue serving as a bridge to promote innovation, scientific collaboration, and technological development amidst increasing global competition.


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