VNUHCM-UNIVERSITY OF SCIENCE WELCOMES THE COLLEGE OF ENGINEERING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY (TAIWAN)

VNUHCM-UNIVERSITY OF SCIENCE WELCOMES THE COLLEGE OF ENGINEERING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY (TAIWAN)

On 4 February 2026, VNUHCM–University of Science (HCMUS) hosted a working session with a delegation from the Department of Materials Science and Engineering, College of Engineering, National Yang Ming Chiao Tung University (NYCU), Taiwan.

Representing the College of Engineering, NYCU, the delegation included: Prof. Albert T. Yeung, Director of International Affairs; Prof. Hong-Cheu Lin, Vice Dean of the College of Engineering; Prof. Cheng-Sheng Huang, Chair of the Department of Mechanical Engineering; Assoc. Prof. Cao Minh Tú, Department of Civil Engineering; Mr Danh La Đức Thanh, a doctoral candidate at the Department of Materials Science and Engineering; and Ms Judy Huang, International Affairs Administrator.

The HCMUS representatives comprised Assoc. Prof. Võ Hồng Hải, Deputy Head of the External Relations Office; Prof. Trần Thị Thanh Vân, Dean of the Faculty of Materials Science and Technology, alongside faculty members and students; and Assoc. Prof. Võ Quốc Khương from the Faculty of Chemistry.

NYCU representatives present institutional updates and research opportunities for postgraduate and undergraduate students.

During the formal session, both institutions focused on strategic cooperation in education, scientific research, and academic exchange. The NYCU delegation provided an overview of academic programmes, research strengths, and the campus environment. Notably, the delegation detailed the BenQ Materials Scholarship—a dedicated fund for postgraduate students in Materials Science and Engineering at NYCU. This scholarship offers a monthly stipend of 20,000 TWD for approximately two years, coupled with career opportunities at the BenQ Materials Corporation in Taiwan or the branch offices in Viet Nam. The programme targets candidates with research backgrounds in biomedical materials and sensors, semiconductor manufacturing, polymer composites, and related fields such as Chemistry, Chemical Engineering, and Biomedical Engineering.

Through this scholarship scheme, both universities expect to expand research collaborations between supervisors at HCMUS and NYCU. This initiative also aims to establish student and faculty exchange models directly aligned with practical industrial requirements.

An information session on scholarships between NYCU and HCMUS students.

In the subsequent briefing, the NYCU delegation introduced the NYCU Summer Programme, a one-to-two-week summer school held at the Hsinchu campus. Participants receive one to two free credits, with accommodation and lunch provided. Significantly, human resources representatives from BenQ Materials Corporation will directly interview students who demonstrate outstanding academic performance and active participation, offering the possibility of securing a BenQ Materials Scholarship on-site.

This working session served to deepen the collaborative relationship established during previous visits. The discussions opened concrete and substantive pathways for training high-quality human resources and advancing scientific research in materials science—a pivotal field for the development of modern high-tech industries.

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