On October 29^th, 2023, the Kick-off ceremony of the Multi-Project Wafer (MPW) took place at the VNUHCM-University of Science.

Attending the ceremony was Assoc.Prof. Nguyễn Minh Tâm, Vice Chancellor of the Viet Nam National University Ho Chi Minh City, Assoc.Prof. Trần Lê Quan, President of VNUHCM-University of Science; Assoc.Prof. Đinh Đức Anh Vũ, Vice President of the International University; together with representatives of groups of IC design experts from member schools such as the University of Science, University of Technology, University of Information Technology, and International University. The University of Sciences will be the focal point for implementing this MPW program with member units of VNU-HCM.

 

The MPW program allows multiple layout designs to be performed on the same die chip, which saves resources, and costs and is suitable for training and scientific research purposes on IC design. With this program, students can participate in a complete chip design stage from analysis, and design using tools, to tape-out, having a real chip and conducting measurements on the chip. This helps students, graduate students or teachers participating in training and research on IC design to fully understand the IC design process, contributing to enhancing the quality of training and research in the field. According to the plan, the first chip will be deployed in February 2024.

In the coming time, VNU-HCM will cooperate with foreign organizations to implement the MPW program on 180nm CMOS technology, then expand the implementation to different processes for member schools of VNU-HCM.