On the 29th of October, 2023, a significant event was hosted at the VNUHCM-University of Science, marking the initiation of the Multi-Project Wafer (MPW).

Attending the ceremony were Assoc. Prof. Nguyễn Minh Tâm, Vice Chancellor of the Viet Nam National University Ho Chi Minh City; Assoc. Prof. Trần Lê Quan, President of VNUHCM-University of Science; and Assoc. Prof. Đinh Đức Anh Vũ, Vice President of the International University, together with representatives of groups of IC design experts from member schools such as the University of Science, University of Technology, University of Information Technology, and International University. The University of Sciences will be the focal point for implementing this MPW programme with member units of VNUHCM.

The MPW programme offers the flexibility to execute multiple layout designs on a single die chip, leading to resource and cost savings. This feature makes it well-suited for educational and research purposes in IC design. With this programme, students can participate in a complete chip design stage, from analysis and design using tools to tape-out, having a real chip, and conducting measurements on the chip. This resource is designed to support the educational and research endeavours of students, graduate students, and teachers engaged in IC design training and research. It aims to facilitate a comprehensive understanding of the IC design process, ultimately contributing to the improvement of training and research quality within this field. According to the current timeline, the initial chip deployment is planned for February 2024.

In the coming time, VNUHCM will cooperate with foreign organisations to implement the MPW programme on 180 nm CMOS technology, then expand the implementation to different processes for member schools of VNUHCM.